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SEMICON Japan 2020 Virtual-1

Published on 2020/12/03

Exhibition overview

SEMICON Japan 2020 was canceled due to the impact of the coronavirus pandemic, but as an alternative, it was decided to hold a virtual event " SEMICON Japan Virtual 2020 " where exhibitions and seminars will be held online.
The online exhibits of exhibitors will be accessible from Friday, December 11, 2020, and will be accessible as an archive until Friday, January 15, 2021. In addition, from December 14th (Monday) to 17th (Thursday), it will be a virtual exhibition where visitors and exhibitors can chat with each other through live distribution, and exhibitors can transmit various information. ing.
By December 3, 2020, the number of exhibitors at "SEMICON Japan Virtual 2020" is about 170 companies (including various organizations and groups). Compared to real exhibitions up to last year, it has decreased significantly.
Among the exhibiting companies, major domestic manufacturers of manufacturing equipment are participating. However, the number of assembly equipment manufacturers exhibiting is small, and some companies, such as Canon, a major wafer processing equipment manufacturer, have been regulars until last year but have not exhibited this time. Also, top overseas companies such as Applied Materials (AMAT), Lam Research, and ASML Holdings did not participate. is said to be

Introduction of exhibiting companies (1)

Exhibiting companies are announcing highlights and exhibiting products, mainly at the start of the exhibition period. I will introduce it this time and next time. This time, by December 3, 2020, we will introduce companies and equipment that are attracting attention from companies that have clarified their exhibition details and announced new products.
HORIBA, Ltd./HORIBA STEC has developed HORIBA's unique control and control systems, such as mass flow controllers, that can contribute to control, management, and evaluation of semiconductor manufacturing and R&D processes, as well as facility monitoring and the development of semiconductor-equipped smart mobility. Access to measurement and analysis solutions is now possible.
Horiba Estec's ultra-thin mass flow controller "DZ-100" and thermal flow splitter "FS-3000" are noteworthy as new products.
Fujikin is also exhibiting mass flow controllers.
It is expected that notable products will be exhibited in testing and inspection equipment as well.
Hitachi High-Tech has announced the defect shape evaluation SEM "CT1000" for semiconductor manufacturing and the high-speed review SEM "CR7300" as new products of the new scanning electron microscope (SEM). As for etching equipment, we mainly introduce the conductor etching equipment "9000" series.
The CT1000 enables three-dimensional observation of pattern shapes on wafers with a diameter of 200 mm or less and defects that occur during the manufacturing process, and is equipped with a function to estimate the constituent elements of the observation target.
The CR7300 uses an electron optical system and a high-speed signal processing system that support high-speed electron beam scanning, which is double that of the previous model, and a new transfer system that shortens the wafer exchange time. is doubling.
Japan Semilab will exhibit inspection and measurement technology ( ion implantation monitoring ) for ion implantation/annealing process control, technology for non-contact evaluation of crystal defects, GaN, SiC, and electrical characteristics of AlGaN/GaN, and introduce it at seminars. I do.
DISCO will exhibit two new fully automatic grinders, "DFG8020" and "DFG8030," which meet diversifying package grinding needs. "DFG8020" supports panel-level packages up to 390 x 390 mm in size. Compatible with "DFG8030" strip (rectangular board). In addition, the new product "DIS100" will be exhibited, which automatically picks up chips from a diced wafer, measures thickness, chipping, back surface roughness, and bending strength (destructive inspection).